IC manufacturing

ZNTC provides full-cycle contract manufacturing of microelectronics and microsystem equipment (MEMS) for industry leading enterprises and start-ups, including engineering and manufacturing development, prototyping and full-scale production.

Abilities

ZNTC constantly modernizes its production facilities and carries out advanced training of employees to ensure high quality of ICs manufacturing.

MEMS

sensors

150 mm

wafer diameter

0,6 - 0,35 mm

design norms

Full manufacturing cycle

The set of manufacturing routes implemented by ZNTC allows to carry out a full cycle of technological services in the field of creating microelectronic products and microsystem equipment, as well as to implement individual technological operations of ICs manufacturing (manufacturing of VLSI, MEMS, SoC).

Services

MEMS magnetoresistive sensors and transducers
MEMS angular velocity sensors (gyroscopes, accelerometers)
Integral photonics elements
Power electronics (GaN-HEMT, IGBT)
Pin diodes, NMOS

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Advantages

Ability to reduce customer costs
for the manufacturing of ICs and MPW
-projects, technology development and fine
tuning of some product parameters.

Completely Russian-made production
at all stages of product manufacturing,
including design, photomasking and ICs
manufacturing and testing.

Technological capabilities

Bonding - debonding
Contact photolithography
on 150 mm wafers on a with the possibility of double-sided alignment
Atomic layer deposition (ALD)
dielectric and conductive coatings, allowing the formation of multicomponent films with unique properties
Bosh-process of Si deep etching
at a speed of up to 15 μm / min
Projection photolithography
in the 1:4 scale on ASML 5500/300C stepper
CVD and PECVD processes
of SiO2, Si3N4,
poly-Si film application
Dry chemical etching process of semiconductors,
dielectrics and metals
Spray wet cleaning process
of semiconductors, dielectrics and metals in the solution
Rapid thermal anneal
for electrical activation of the implanted interstitial diffusant and the silicide formation on the surface of active Si-structures
Ion etching
of metallic and non-metallic films such as iron, platinum, ferroelectric ceramics, etc.
Implantation of standard (B, P, As) ions
of energy range from 20 to 200 keV with the possibility of implantation of doubly charged ions on the IMC-200 installation. Dose range: from 1x1011 to 1x1018 cm-2.
PVD magnetron deposition
of conductive dielectric and ferroelectric coatings with thicknesses from 1nm to 1200nm
Gas phase etching
of semiconductors and dielectrics to remove sacrificial layers in the MEMS manufacturing route.
Wafer sintering to form SOI structures

We always take into account customer needs and are ready to work on new interesting projects to expand our production capabilities.

Galina Shirkova
Head of IC manufacturing at ZNTC

NEW
TECHNOLOGIES

To implement innovative projects in the field of power electronics based on GaN(Si) and integrated photonic for telecommunications, we created a new technological infrastructure.

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